@misc{indiciaee4f5a08bfedb,
  title = {Report on power, thermal and reliability prediction for 3D Networks-on-Chip},
  author = {Khanh N. Dang and Akram Ben Ahmed and Abderazek Ben Abdallah and Xuan-Tu Tran},
  year = {2020},
  url = {https://arxiv.org/abs/2003.08648},
  note = {Source identifier: 2003.08648}
}