TY  - RPRT
TI  - Mechanisms of jump to contact and conductance plateau formation in copper atomic junctions in vacuum and aqueous environments
AU  - Alireza Saffarzadeh
AU  - George Kirczenow
PY  - 2020
DO  - 10.1103/physrevmaterials.4.056004
UR  - https://arxiv.org/abs/2005.07873
ID  - 2005.07873
ER  -