@misc{indiciae81f2ecdac65b,
  title = {A high entropy alloy as very low melting point solder for advanced electronic packaging},
  author = {Yingxia Liua and Li Pu and Yong Yang and Quanfeng He and Ziqing Zhou and Chengwen Tan and Xiuchen Zhao and Qingshan Zhang and K. N. Tu},
  year = {2020},
  url = {https://arxiv.org/abs/2006.01345},
  note = {Source identifier: 2006.01345}
}