@misc{indiciaebbb0a43fce59,
  title = {In-situ study of creep in Sn-3Ag-0.5Cu solder},
  author = {Tianhong Gu and Vivian Tong and Christopher M. Gourlay and T. Ben Britton},
  year = {2020},
  url = {https://arxiv.org/abs/2006.05904},
  note = {Source identifier: 2006.05904}
}