@misc{indiciaefd302e870122,
  title = {The role of lengthscale in the creep of Sn-3Ag-0.5Cu solder microstructures},
  author = {Tianhong Gu and Christopher M. Gourlay and T. Ben Britton},
  year = {2020},
  doi = {10.1007/s11664-020-08697-4},
  url = {https://arxiv.org/abs/2007.08266},
  note = {Source identifier: 2007.08266}
}