TY  - RPRT
TI  - The role of lengthscale in the creep of Sn-3Ag-0.5Cu solder microstructures
AU  - Tianhong Gu
AU  - Christopher M. Gourlay
AU  - T. Ben Britton
PY  - 2020
DO  - 10.1007/s11664-020-08697-4
UR  - https://arxiv.org/abs/2007.08266
ID  - 2007.08266
ER  -