@misc{indiciae4eb3d4be9a1f,
  title = {Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology},
  author = {Rahul Mathur and Chien-Ju Chao and Rossana Liu and Nikhil Tadepalli and Pranavi Chandupatla and Shawn Hung and Xiaoqing Xu and Saurabh Sinha and Jaydeep Kulkarni},
  year = {2020},
  url = {https://arxiv.org/abs/2007.16179},
  note = {Source identifier: 2007.16179}
}