TY  - RPRT
TI  - Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology
AU  - Rahul Mathur
AU  - Chien-Ju Chao
AU  - Rossana Liu
AU  - Nikhil Tadepalli
AU  - Pranavi Chandupatla
AU  - Shawn Hung
AU  - Xiaoqing Xu
AU  - Saurabh Sinha
AU  - Jaydeep Kulkarni
PY  - 2020
UR  - https://arxiv.org/abs/2007.16179
ID  - 2007.16179
ER  -