@misc{indiciae009b88d7824e,
  title = {Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending},
  author = {Freddie Hong and Connor Myant and David Boyle},
  year = {2021},
  doi = {10.1145/3411764.3445469},
  url = {https://arxiv.org/abs/2011.06473},
  note = {Source identifier: 2011.06473}
}