TY  - RPRT
TI  - Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending
AU  - Freddie Hong
AU  - Connor Myant
AU  - David Boyle
PY  - 2021
DO  - 10.1145/3411764.3445469
UR  - https://arxiv.org/abs/2011.06473
ID  - 2011.06473
ER  -