TY  - RPRT
TI  - Ultra-High-density 3D vertical RRAM with stacked JunctionLess nanowires for In-Memory-Computing applications
AU  - M. Ezzadeen
AU  - D. Bosch
AU  - B. Giraud
AU  - S. Barraud
AU  - J. -P. Noel
AU  - D. Lattard
AU  - J. Lacord
AU  - J. -M. Portal
AU  - F. Andrieu
PY  - 2020
DO  - 10.1109/ted.2020.3020779
UR  - https://arxiv.org/abs/2012.00061
ID  - 2012.00061
ER  -