@misc{indiciae38e05372c37c,
  title = {Proof of Concept for Through Silicon Vias (TSVs) in Application Specific Integrated Circuits (ASICs) for Hard X-ray Imaging Detectors},
  author = {Jaesub Hong and Jonathan Grindlay and Branden Allen and Daniel P. Violette and Hiromasa Miyasaka and Dean Malta and Jennifer Ovental and David Bordelon and Daniel Richter},
  year = {2021},
  url = {https://arxiv.org/abs/2103.08749},
  note = {Source identifier: 2103.08749}
}