TY  - RPRT
TI  - Proof of Concept for Through Silicon Vias (TSVs) in Application Specific Integrated Circuits (ASICs) for Hard X-ray Imaging Detectors
AU  - Jaesub Hong
AU  - Jonathan Grindlay
AU  - Branden Allen
AU  - Daniel P. Violette
AU  - Hiromasa Miyasaka
AU  - Dean Malta
AU  - Jennifer Ovental
AU  - David Bordelon
AU  - Daniel Richter
PY  - 2021
UR  - https://arxiv.org/abs/2103.08749
ID  - 2103.08749
ER  -