@misc{indiciae3662982338b2,
  title = {Topological Semimetals for Scaled Back-End-Of-Line Interconnect Beyond Cu},
  author = {Ching-Tzu Chen and Utkarsh Bajpai and Nicholas A. Lanzillo and Chuang-Han Hsu and Hsin Lin and Gengchiau Liang},
  year = {2021},
  doi = {10.1109/iedm13553.2020.9371996},
  url = {https://arxiv.org/abs/2103.10505},
  note = {Source identifier: 2103.10505}
}