TY  - RPRT
TI  - Topological Semimetals for Scaled Back-End-Of-Line Interconnect Beyond Cu
AU  - Ching-Tzu Chen
AU  - Utkarsh Bajpai
AU  - Nicholas A. Lanzillo
AU  - Chuang-Han Hsu
AU  - Hsin Lin
AU  - Gengchiau Liang
PY  - 2021
DO  - 10.1109/iedm13553.2020.9371996
UR  - https://arxiv.org/abs/2103.10505
ID  - 2103.10505
ER  -