@misc{indiciaeec35041c0144,
  title = {Reduced etch lag and high aspect ratios by deep reactive ion etching (DRIE)},
  author = {M. S. Gerlt and N. F. Läubli and M. Manser and B. J. Nelson and J. Dual},
  year = {2021},
  doi = {10.3390/mi12050542},
  url = {https://arxiv.org/abs/2104.02763},
  note = {Source identifier: 2104.02763}
}