TY  - RPRT
TI  - Reduced etch lag and high aspect ratios by deep reactive ion etching (DRIE)
AU  - M. S. Gerlt
AU  - N. F. Läubli
AU  - M. Manser
AU  - B. J. Nelson
AU  - J. Dual
PY  - 2021
DO  - 10.3390/mi12050542
UR  - https://arxiv.org/abs/2104.02763
ID  - 2104.02763
ER  -