TY  - RPRT
TI  - Contact resistance of various metallisation schemes to superconducting boron doped diamond between 1.9 and 300 K
AU  - Scott A. Manifold
AU  - Georgina Klemencic
AU  - Evan L. H. Thomas
AU  - Soumen Mandal
AU  - Henry Bland
AU  - Sean R. Giblin
AU  - Oliver A. Williams
PY  - 2021
DO  - 10.1016/j.carbon.2021.02.079
UR  - https://arxiv.org/abs/2105.02839
ID  - 2105.02839
ER  -