@misc{indiciaee07425933d29,
  title = {Hermetic chip-scale packaging using Au:Sn eutectic bonding for implantable devices},
  author = {Katarzyna M. Szostak and Meysam Keshavarz and Timothy G. Constandinou},
  year = {2021},
  doi = {10.1088/1361-6439/ac12a1},
  url = {https://arxiv.org/abs/2105.13156},
  note = {Source identifier: 2105.13156}
}