TY  - RPRT
TI  - Hermetic chip-scale packaging using Au:Sn eutectic bonding for implantable devices
AU  - Katarzyna M. Szostak
AU  - Meysam Keshavarz
AU  - Timothy G. Constandinou
PY  - 2021
DO  - 10.1088/1361-6439/ac12a1
UR  - https://arxiv.org/abs/2105.13156
ID  - 2105.13156
ER  -