TY  - RPRT
TI  - 2D Materials for Future Heterogeneous Electronics
AU  - Max C. Lemme
AU  - Deji Akinwande
AU  - Cedric Huyghebaert
AU  - Christoph Stampfer
PY  - 2022
DO  - 10.1038/s41467-022-29001-4
UR  - https://arxiv.org/abs/2110.08007
ID  - 2110.08007
ER  -