@misc{indiciaef567e404723a,
  title = {A Methodology for Thermal Simulation of Interconnects Enabled by Model Reduction with Material Property Variation},
  author = {Wangkun Jia and Ming-C. Cheng},
  year = {2021},
  doi = {10.1016/j.jocs.2022.101665},
  url = {https://arxiv.org/abs/2112.03023},
  note = {Source identifier: 2112.03023}
}