TY  - RPRT
TI  - A Methodology for Thermal Simulation of Interconnects Enabled by Model Reduction with Material Property Variation
AU  - Wangkun Jia
AU  - Ming-C. Cheng
PY  - 2021
DO  - 10.1016/j.jocs.2022.101665
UR  - https://arxiv.org/abs/2112.03023
ID  - 2112.03023
ER  -