@misc{indiciae887683035ed0,
  title = {Testing Station for Fast Screening of Through Silicon Via (TSV)-enabled Application Specific Integrated Circuits (ASICs) for Hard X-ray Imaging Detectors},
  author = {Daniel P. Violette and Branden Allen and Jaesub Hong and Hiromasa Miyasaka and Jonathan Grindlay},
  year = {2022},
  url = {https://arxiv.org/abs/2204.01864},
  note = {Source identifier: 2204.01864}
}