@misc{indiciae7196620b1b68,
  title = {A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints},
  author = {Yilun Xu and Jingwei Xian and Stoyan Stoyanov and Chris Bailey and Richard J. Coyle and Christopher M. Gourlay and Fionn P. E. Dunne},
  year = {2022},
  doi = {10.1016/j.ijplas.2022.103308},
  url = {https://arxiv.org/abs/2204.05583},
  note = {Source identifier: 2204.05583}
}