@misc{indiciae40ffa143b0d3,
  title = {Cryogenic and hermetically sealed packaging of photonic chips for optomechanics},
  author = {W. W. Wasserman and R. A. Harrison and G. I. Harris and A. Sawadsky and Y. L. Sfendla and W. P. Bowen and C. G. Baker},
  year = {2022},
  doi = {10.1364/oe.463752},
  url = {https://arxiv.org/abs/2205.14143},
  note = {Source identifier: 2205.14143}
}