@misc{indiciaeb95f7f56f039,
  title = {A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing},
  author = {Lamia Alam and Nasser Kehtarnavaz},
  year = {2022},
  url = {https://arxiv.org/abs/2206.07481},
  note = {Source identifier: 2206.07481}
}