@misc{indiciae01bf3e90fa90,
  title = {Overview and study of the 3D-TSV interconnects induced coupling in CMOS circuits},
  author = {Mohamed El Amine Benkechkache and Saida Latreche and Lamis Ghoualmi},
  year = {2022},
  url = {https://arxiv.org/abs/2209.02230},
  note = {Source identifier: 2209.02230}
}