@misc{indiciaed32315e74072,
  title = {Ultrasonic Delamination Based Adhesion Testing for High-Throughput Assembly of van der Waals Heterostructures},
  author = {Tara Peña and Jewel Holt and Arfan Sewaket and Stephen M. Wu},
  year = {2022},
  doi = {10.1063/5.0126446},
  url = {https://arxiv.org/abs/2210.03486},
  note = {Source identifier: 2210.03486}
}