TY  - RPRT
TI  - Ultrasonic Delamination Based Adhesion Testing for High-Throughput Assembly of van der Waals Heterostructures
AU  - Tara Peña
AU  - Jewel Holt
AU  - Arfan Sewaket
AU  - Stephen M. Wu
PY  - 2022
DO  - 10.1063/5.0126446
UR  - https://arxiv.org/abs/2210.03486
ID  - 2210.03486
ER  -