@misc{indiciae07242d643159,
  title = {Thermal resistance in superconducting flip-chip assemblies},
  author = {Joel Hätinen and Emma Mykkänen and Klaara Viisanen and Alberto Ronzani and Antti Kemppinen and Lassi Lehtisyrjä and Janne S. Lehtinen and Mika Prunnila},
  year = {2023},
  doi = {10.1063/5.0162409},
  url = {https://arxiv.org/abs/2303.01228},
  note = {Source identifier: 2303.01228}
}