@misc{indiciae9945c791c4f2,
  title = {Plated-Through-Hole Via Design Specifications for 112G Serial Links},
  author = {Michael J. Degerstrom and Chad M. Smutzer and Richard B. Ericson and Clifton R Haider and Barry K. Gilbert},
  year = {2023},
  url = {https://arxiv.org/abs/2304.01913},
  note = {Source identifier: 2304.01913}
}