TY  - RPRT
TI  - Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration
AU  - Madhava Sarma Vemuri
AU  - Umamaheswara Rao Tida
PY  - 2023
UR  - https://arxiv.org/abs/2304.13808
ID  - 2304.13808
ER  -