@misc{indiciae2329af756511,
  title = {Bottom-up Integration of TMDCs with Pre-Patterned Device Architectures via Transfer-free Chemical Vapor Deposition},
  author = {Lucas M. Sassi and Sathvik Ajay Iyengar and Anand B. Puthirath and Yuefei Huang and Xingfu Li and Tanguy Terlier and Ali Mojibpour and Ana Paula C. Teixeira and Palash Bharadwaj and Chandra Sekhar Tiwary and Robert Vajtai and Saikat Talapatra and Boris Yakobson and Pulickel M. Ajayan},
  year = {2023},
  url = {https://arxiv.org/abs/2305.14554},
  note = {Source identifier: 2305.14554}
}