@misc{indiciae62f27539a2cd,
  title = {In-Situ Thickness Measurement of Die Silicon Using Voltage Imaging for Hardware Assurance},
  author = {Olivia P. Dizon-Paradis and Nitin Varshney and M Tanjidur Rahman and Michael Strizich and Haoting Shen and Navid Asadizanjani},
  year = {2023},
  url = {https://arxiv.org/abs/2307.13118},
  note = {Source identifier: 2307.13118}
}