@misc{indiciae5a840cc9ed49,
  title = {US Microelectronics Packaging Ecosystem: Challenges and Opportunities},
  author = {Rouhan Noor and Himanandhan Reddy Kottur and Patrick J Craig and Liton Kumar Biswas and M Shafkat M Khan and Nitin Varshney and Hamed Dalir and Elif Akçalı and Bahareh Ghane Motlagh and Charles Woychik and Yong-Kyu Yoon and Navid Asadizanjani},
  year = {2023},
  url = {https://arxiv.org/abs/2310.11651},
  note = {Source identifier: 2310.11651}
}