@misc{indiciaeb03de8fadf59,
  title = {The role of microstructure in the thermal fatigue of solder joints},
  author = {J. W. Xian and Y. L. Xu and S. Stoyanov and R. J. Coyle and F. P. E. Dunne and C. M. Gourlay},
  year = {2024},
  doi = {10.1038/s41467-024-48532-6},
  url = {https://arxiv.org/abs/2311.03891},
  note = {Source identifier: 2311.03891}
}