TY  - RPRT
TI  - Thermalization of a SQUID chip at cryogenic temperature: Thermal conductance measurement for GE 7031 Varnish Glue, Apiezon N Grease and Rubber Cement between 20 and 200 mK
AU  - M. D'Andrea
AU  - G. Torrioli
AU  - C. Macculi
AU  - M. Kiviranta
PY  - 2024
DO  - 10.1007/s10909-023-03038-1
UR  - https://arxiv.org/abs/2401.11846
ID  - 2401.11846
ER  -