@misc{indiciaeeab642f65aaf,
  title = {Amorphous Boron Nitride as an Ultrathin Copper Diffusion Barrier for Advanced Interconnects},
  author = {Onurcan Kaya and Hyeongjoon Kim and Byeongkyu Kim and Thomas Galvani and Luigi Colombo and Mario Lanza and Hyeon-Jin Shin and Ivan Cole and Hyeon Suk Shin and Stephan Roche},
  year = {2025},
  url = {https://arxiv.org/abs/2402.01251},
  note = {Source identifier: 2402.01251}
}