@misc{indiciae6317fee48fa0,
  title = {Thermal-Aware Floorplanner for 3D IC, including TSVs, Liquid Microchannels and Thermal Domains Optimization},
  author = {David Cuesta and José L. Risco-Martín and José L. Ayala and J. Ignacio Hidalgo},
  year = {2024},
  doi = {10.1016/j.asoc.2015.04.052},
  url = {https://arxiv.org/abs/2402.14627},
  note = {Source identifier: 2402.14627}
}