TY  - RPRT
TI  - Thermal-Aware Floorplanner for 3D IC, including TSVs, Liquid Microchannels and Thermal Domains Optimization
AU  - David Cuesta
AU  - José L. Risco-Martín
AU  - José L. Ayala
AU  - J. Ignacio Hidalgo
PY  - 2024
DO  - 10.1016/j.asoc.2015.04.052
UR  - https://arxiv.org/abs/2402.14627
ID  - 2402.14627
ER  -