@misc{indiciae14287e7ba295,
  title = {3D-Printed Dielectric Image Lines towards Chip-to-Chip Interconnects for subTHz-Applications},
  author = {Leonhard Hahn and Tim Pfahler and Tobias Bader and Gerald Gold and Martin Vossiek and Christian Carlowitz},
  year = {2024},
  url = {https://arxiv.org/abs/2403.03657},
  note = {Source identifier: 2403.03657}
}