TY  - RPRT
TI  - 3D-Printed Dielectric Image Lines towards Chip-to-Chip Interconnects for subTHz-Applications
AU  - Leonhard Hahn
AU  - Tim Pfahler
AU  - Tobias Bader
AU  - Gerald Gold
AU  - Martin Vossiek
AU  - Christian Carlowitz
PY  - 2024
UR  - https://arxiv.org/abs/2403.03657
ID  - 2403.03657
ER  -