@misc{indiciae04f00acfd1d6,
  title = {Enhancing and Mapping Thermal Boundary Conductance across Bonded Si/SiC Interface},
  author = {Rulei Guo and Bin Xu and Fengwen Mu and Junichiro Shiomi},
  year = {2024},
  url = {https://arxiv.org/abs/2406.17275},
  note = {Source identifier: 2406.17275}
}