TY  - RPRT
TI  - Enhancing and Mapping Thermal Boundary Conductance across Bonded Si/SiC Interface
AU  - Rulei Guo
AU  - Bin Xu
AU  - Fengwen Mu
AU  - Junichiro Shiomi
PY  - 2024
UR  - https://arxiv.org/abs/2406.17275
ID  - 2406.17275
ER  -