TY  - RPRT
TI  - Droplet-confined electroplating for nanoscale additive manufacturing: current control of the initial stages of the growth of copper nanowires
AU  - Mirco Nydegger
AU  - Ralph Spolenak
PY  - 2024
UR  - https://arxiv.org/abs/2408.00660
ID  - 2408.00660
ER  -