@misc{indiciae244a1205ef68,
  title = {Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer},
  author = {Achintya Paradkar and Paul Nicaise and Karim Dakroury and Fabian Resare and Witlef Wieczorek},
  year = {2025},
  doi = {10.1063/5.0235266},
  url = {https://arxiv.org/abs/2408.14655},
  note = {Source identifier: 2408.14655}
}