TY  - RPRT
TI  - Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer
AU  - Achintya Paradkar
AU  - Paul Nicaise
AU  - Karim Dakroury
AU  - Fabian Resare
AU  - Witlef Wieczorek
PY  - 2025
DO  - 10.1063/5.0235266
UR  - https://arxiv.org/abs/2408.14655
ID  - 2408.14655
ER  -