@misc{indiciae653cfa6a7459,
  title = {From Flip FET to Flip 3D Integration (F3D): Maximizing the Scaling Potential of Wafer Both Sides Beyond Conventional 3D Integration},
  author = {Heng Wu and Haoran Lu and Wanyue Peng and Ziqiao Xu and Yanbang Chu and Jiacheng Sun and Falong Zhou and Jack Wu and Lijie Zhang and Weihai Bu and Jin Kang and Ming Li and Yibo Lin and Runsheng Wang and Xin Zhang and Ru Huang},
  year = {2024},
  url = {https://arxiv.org/abs/2411.00309},
  note = {Source identifier: 2411.00309}
}