@misc{indiciae55f16e1b6a24,
  title = {MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC},
  author = {Tianxiang Zhu and Qipan Wang and Yibo Lin and Runsheng Wang and Ru Huang},
  year = {2024},
  url = {https://arxiv.org/abs/2411.12690},
  note = {Source identifier: 2411.12690}
}